JPH0582739B2 - - Google Patents

Info

Publication number
JPH0582739B2
JPH0582739B2 JP59141592A JP14159284A JPH0582739B2 JP H0582739 B2 JPH0582739 B2 JP H0582739B2 JP 59141592 A JP59141592 A JP 59141592A JP 14159284 A JP14159284 A JP 14159284A JP H0582739 B2 JPH0582739 B2 JP H0582739B2
Authority
JP
Japan
Prior art keywords
bonding
frame
circuit boards
mark
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59141592A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120345A (ja
Inventor
Masayoshi Yamaguchi
Masahito Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
AGC Techno Glass Co Ltd
Original Assignee
Toshiba Corp
Toshiba Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Glass Co Ltd filed Critical Toshiba Corp
Priority to JP59141592A priority Critical patent/JPS6120345A/ja
Publication of JPS6120345A publication Critical patent/JPS6120345A/ja
Publication of JPH0582739B2 publication Critical patent/JPH0582739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59141592A 1984-07-09 1984-07-09 ボンディング方法およびボンディング装置 Granted JPS6120345A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59141592A JPS6120345A (ja) 1984-07-09 1984-07-09 ボンディング方法およびボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59141592A JPS6120345A (ja) 1984-07-09 1984-07-09 ボンディング方法およびボンディング装置

Publications (2)

Publication Number Publication Date
JPS6120345A JPS6120345A (ja) 1986-01-29
JPH0582739B2 true JPH0582739B2 (en]) 1993-11-22

Family

ID=15295590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59141592A Granted JPS6120345A (ja) 1984-07-09 1984-07-09 ボンディング方法およびボンディング装置

Country Status (1)

Country Link
JP (1) JPS6120345A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167558A (en) * 1988-07-22 1992-12-01 Zenith Electronics Corporation System for registering and assembling tension masks and CRT faceplates
JPH0793340B2 (ja) * 1989-08-18 1995-10-09 株式会社東芝 半導体装置の配線接続装置
US5033665A (en) * 1990-02-23 1991-07-23 Toddco General Soldering system and method of using same
US5257714A (en) * 1990-11-20 1993-11-02 International Business Machines Corporation Method and apparatus for electronic component lead inspection
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565854U (en]) * 1978-10-26 1980-05-07

Also Published As

Publication number Publication date
JPS6120345A (ja) 1986-01-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees